Research Academics  
 
   
Technology Services
 
 
Take advantage of our long experience in MEMS, silicon and silicon carbide
technology.
MEMS Processes : Special Processes:
- Thermal Oxidation
- LPCVD (Poly-Si, SiO2, Si3N4, PSG)
- PECVD (SiO2, Si3N4, SiON)
- Sputtering
- Rapid Thermal Processing
- Lithographie (single & double side)
- Reactive Ion Etching
- Wet Etching
- Silicides (TiSi2, WSi2)
- Dicing Service
- Technology Service
- Anisotropic Wet Etching
- Deep Silicon Etching (Bosch Process)
- Surface- and Bulk Micromachining
- SiC- Etching Processes
- Anodic bonding
- Wafer Bonding
- Packaging
Contact Person:

  Prof. Dr.-Ing. Ha-Duong Ngo


Phone: +49 30 314 72 522
Fax: +49 30 314 72 603
E-Mail: ngo@mat.ee.tu-berlin.de