Research Academics  
 
   
 
2016
 

Ngo, Ha-Duong: 
Energy-autarkic smart sensor insole for telemedical patient monitoring 
München, 2016

Kleff, Jessica; Schlottig, Gerd; Mroßko, Raúl; Steller, Wolfram; Oppermann, Hermann; Keller, Jürgen; Brunschwiler, Thomas  
Intra-stack sealing of tier interconnects using the interconnect alloy 
ESTC 2016, Grenoble , 2016

Prof. Dr.-Ing. Ha Duong Ngo
Zero Characterization of Anodic Bondable LTCC for Wafer-Level Packaging

Prof. Dr.-Ing. Ha Duong Ngo
Development and fabrication of a very High-g sensor for very high impact applications

Prof. Dr.-Ing. Ha Duong Ngo
Packaging solution for a novel silicon-based trace humidity sensor using coulometric method

Prof. Dr.-Ing. Ha Duong Ngo
Investigation of residual stress effect during the anodic bonding process with different bondable materials for MEMS Wafer Level Packaging Design

Prof. Dr.-Ing. Ha Duong Ngo
Novel High Reliable Si-Based Trace Humidity Sensor Array for Aerospace and Process Industry

Prof. Dr.-Ing. Ha Duong Ngo
Embedding of wearable electronics into smart sensor insole

Prof. Dr.-Ing. Ha Duong Ngo
Routes to Graphene based Gas Sensors

Prof. Dr.-Ing. Ha Duong Ngo
Smarte Sensorschueinlage für telemedizinisches Patientenmonitoring

Prof. Dr.-Ing. Ha Duong Ngo
Vitaldatenmessung mit smarter Sensorschuheinlage für die Telemedizing

Prof. Dr.-Ing. Ha Duong Ngo
WSi-WSiN-Pt metallization scheme for Silicon Carbide Based high temperature Microsystems