Research Academics  
 
   
 
2009
 

A. Berns, E. Obermeier, X.H. Wang, J. Domhardt, J. Leuckert, W. Nitsche
AeroMEMS Sensor with Integrated Pressure and Hot-Wire Sensor for High-Frequency Transition Detection
47th AIAA Aerospace Sciences Meetings and Exhibit
January 5-8, 2009, Orlando, FL
AIAA-2009-0318.

[abstract]

H.-D. Ngo, J. Leib
Wafer Level Packaging Technology for optical imaging sensors
Eurosensors XXIII Proceeding
. Elservier ScienceDirect, Procedia Chemistry, Volume 1, Issue 1, Pages 17-20
September, 2009, Lausanne, Switzerland
AE 001.

W. Kurniawan, E. Obermeier
Bulk-type piezoresistive force sensor for high pressure applications
Eurosensors XXIII Proceeding. Elservier ScienceDirect, Procedia Chemistry, Volume 1, Issue 1, Pages 544-547
September, 2009, Lausanne, Switzerland
AE 4L-B.
 
 J. Leib, H.-D. Ngo,  M. Toepper
Tapered Through-Silicon-Via Interconnects for Wafer-Level Packaging of Sensor Devices
IEEE Transactions on Advanced Packaging
2009