Research Academics  
 
   
 
1995
 
J. Fricke, E. Obermeier
Surface Micromachined Accelerometer Based on a Torsional Moving Structure
Technical Digest of Transducers 95, Eurosensors IX, Stockholm, 1995
[abstract]
L. Qui, E. Obermeier
A Microsensor with Integrated Heat Sink and Flow Guide for Gas Flow Sensing Applications
Technical Digest of Transducers 95, Eurosensors IX, Stockholm, 1995
[abstract]
P. Krause, E. Obermeier, W. Wehl
Backshooter - A New Smart Micromachined Single-Chip Inkjet Printhead
Technical Digest of Transducers 95, Eurosensors IX, Stockholm, 1995
[abstract]
D. Mutschall, C. Scheibe, E. Obermeier
Basic Micro Module for Chemical Sensors with On Chip Heater and Buried Sensor Structure Technical Digest of Transducers 95, Eurosensors IX, Stockholm, 1995
[abstract]
P. Krause, M. Sporys, E. Obermeier, K. Lange, S. Grigull
Silicon to Silicon Anodic Bonding using Evaporated Glass
Technical Digest of Transducers 95, Eurosensors IX, Stockholm, 1995
[abstract]
E. Obermeier
High Temperature Microsensors Based on Polycrystalline Diamond Thin Films
Technical Digest of Transducers 95, Eurosensors IX, Stockholm, 1995
[abstract]
D. Maier-Schneider, A. Ersoy, J. Maibach, D. Schneider, E. Obermeier
Influence of Annealing on Elastic Properties of LPCVD Silicon Nitride and LPCVD Polysilicon Sensors and Materials, Vol. 7 No.2,121-129, 1995
[abstract]
P. Krause, E. Obermeier
Etch Rate and Surface Roughness of Deep Narrow U-Grooves in (110)-oriented silicon
J. of Micromechanic and Microengineering 5, 1995
[abstract]
D. Maier-Schneider
LPCVD-Polysilizium in der Mikromechanik: Bestimmung der elastischen Eigenschaften
Ph.D. thesis, TU Berlin, 1995
[abstract]
D. Maier-Schneider, J. Maibach, E. Obermeier, D. Schneider
Variations in Young's Modulus and Intrinsic Stress of LPCVD-Polysilicon due to High Temperature Annealing
J. Micromech. Microeng., Vol. 5 No. 2, 121-124, 1995
[abstract]
E. Jansen, E. Obermeier
Thermal Conductivity Measurements on Thin Films Based on Micromechanical Devices
Technical Digest MME '95, Copenhagen, 175-178, 1995
[abstract]
T. Diepold, E. Obermeier
Smoothing of Ultrasonically Drilled Holes in Borosilicate Glass by Wet Chemical Ecthing Technical Digest MME '95, Copenhagen, 35-38, 1995
[abstract]
D. Maier-Schneider, J. Maibach, E. Obermeier
A New Analytical Solution for the Load-Deflection of Square Membranes
J. of Microelectromechanical Systems, Vol. 4, No.4, Dez. 1995
[abstract]
R. Lossy, W. Reichert, E. Obermeier and J. Stoemenos
High temperature implantation of Beta-SiC and its characterization
Technical Digest of Int. Conf on SiC and Related Materials - ICSCRM - 95 -, Kyoto, Japan, 1995, 529
[abstract]
W. Reichert, R. Lossy, J.M. Gonzalez Sirgo, E. Obermeier, and J. Stoemenos
Beta-SiC deposited on SIMOX substrates: characterization of the SiC/SOI system at elevated temperatures
Technical Digest of Int. Conf on SiC and Related Materials - ICSCRM - 95 -, Kyoto, Japan, 1995, 607
[abstract]
S. Hein
Mikromechanischer kapazitiver Differenzdrucksensor mit hoher Ueberlastfestigkeit in Silicium/Glas-Technologie
Ph.D. thesis, TU Berlin, 1995
[abstract]
C. Scheibe
Design und Realisierung eines kapazitiven Gassensorelementes mit integrierter Heizung fuer Betriebstemperaturen bis 450 C
Ph.D. thesis, TU Berlin, 1995
[abstract]